Novel x-ray interferometers for length metrology PhD

Length metrology is fundamental to all areas of advanced manufacturing. For nanotechnology, where the size of devices (e.g. semiconductor and quantum based) is shrinking, and performance in some cases, is exponentially dependent on nanoscale dimensions, the need for sub-nanometre length metrology is growing.

To meet this challenge, the lattice parameter of silicon has been formally adopted as the basis of a length scale for nanotechnology. One method for implementing this is x-ray interferometry; a ruler or positioning system stage for nanometrology with subatomic accuracy.

The aim of the project is to design and manufacture efficiently x-ray interferometers suitable for a range of dimensional nanometrology applications including ultra-precision positioning and characterisation of nanoscale displacement sensors that will support manufacturing of micro-electronics and quantum devices.

The manufacture of X-ray interferometers is very challenging requiring expertise in machining of brittle materials, high aspect ratio structures and minimisation of surface damage from the machining, all of which need to exploit recent advances in ultraprecision machining techniques.

Other aspects of the research include using finite element analysis to model and design and digitally twin high accuracy silicon flexure stages and sub nanometre scale length metrology.