Find out more about our range of electron microscopes with specialist detectors operated by specialist trained dedicated staff aimed at a broad range of applications for both routine and urgent analysis reporting.

Focused ion beam field emission scanning electron microscope (FIB-FESEM)

Left: gas injection system tip, nanomanipulator tip and Cu grid inside the S8000G sample chamber during TEM lamella production,
Right: FIB milled TEM lamella on a nanomanipulator tip during alignment with the Cu post on TEM grid prior to attachment.

FIB-FESEM with integrated TOF-SIMS

  • TESCAN Solaris X, focused ion beam field emission scanning electron microscope (FIB-FESEM) and integrated time-of-flight secondary ion mass spectrometer (TOF-SIMS),
  • Field emission electron source and immersion lens,
  • Xe plasma source,
  • Secondary and backscatter electron detectors,
  • Nanomanipulator for lamella liftouts.

Scanning electron microscopy


  • TESCAN Vega 3, variable pressure scanning electron microscopes for high resolution imaging (three available),
  • Giant and large chambers (GMU and LMU),
  • Tungsten filament sources,
  • High and low vacuum modes,
  • Oxford instruments EDS detectors,
  • Secondary and backscatter electron detectors,
  • Nordlys Nano EBSD (on GMU).

Hitachi SU5000 field emission scanning electron microscope

  • Secondary electron detectors, lower, top and variable pressure,
  • 5 segment backscatter detector,
  • Conventional and variable pressure modes,
  • EDAX TEAM EDS microanalysis system.

Hitachi SU3500 scanning electron microscope

  • Tungsten filament,
  • Secondary detectors; conventional and variable pressure,
  • 5 segment backscatter detector,
  • EDAX TEAM EDS microanalysis system,
  • Conventional and variable pressure modes.

Additional facilities

  • Philips CM20 TEM,
  • Bruker D5005 X-ray diffractometers,
  • Bruker AFM D3100,
  • Bruker DEKTAK,
  • Micro Materials NanoTest,
  • Spectrometry (Raman, UV-VIS and FTIR),
  • Expert sample preparation equipment.

Microscopy services - state-of-the-art facilities

Focused ion beam field emission scanning electron microscope (FIB-FESEM)

Left: gas injection system tip, nanomanipulator tip and Cu grid inside the S8000G sample chamber during TEM lamella production,
Right: FIB milled TEM lamella on a nanomanipulator tip during alignment with the Cu post on TEM grid prior to attachment.

FIB-FESEM with integrated TOF-SIMS

  • TESCAN Solaris X, focused ion beam field emission scanning electron microscope (FIB-FESEM) and integrated time-of-flight secondary ion mass spectrometer (TOF-SIMS),
  • Field emission electron source and immersion lens,
  • Xe plasma source,
  • Secondary and backscatter electron detectors,
  • Nanomanipulator for lamella liftouts.

Scanning electron microscopy


  • TESCAN Vega 3, variable pressure scanning electron microscopes for high resolution imaging (three available),
  • Giant and large chambers (GMU and LMU),
  • Tungsten filament sources,
  • High and low vacuum modes,
  • Oxford instruments EDS detectors,
  • Secondary and backscatter electron detectors,
  • Nordlys Nano EBSD (on GMU).

Hitachi SU5000 field emission scanning electron microscope

  • Secondary electron detectors, lower, top and variable pressure,
  • 5 segment backscatter detector,
  • Conventional and variable pressure modes,
  • EDAX TEAM EDS microanalysis system.

Hitachi SU3500 scanning electron microscope

  • Tungsten filament,
  • Secondary detectors; conventional and variable pressure,
  • 5 segment backscatter detector,
  • EDAX TEAM EDS microanalysis system,
  • Conventional and variable pressure modes.

Additional facilities

  • Philips CM20 TEM,
  • Bruker D5005 X-ray diffractometers,
  • Bruker AFM D3100,
  • Bruker DEKTAK,
  • Micro Materials NanoTest,
  • Spectrometry (Raman, UV-VIS and FTIR),
  • Expert sample preparation equipment.